Samsung Electronics the leader in advanced memory solutions, announced today that it is already offering in mass production the thinnest 12 nm-class 12 GB and 16 GB LPDDR5X DRAMs thus strengthening its position in the low power-related DRAM segment. Co-opting Samsung’s long-rooted experience in chip packaging, Samsung can offer ultra-slim LPDDR5X DRAM packages of its own, which, in return, lets mobile devices have extra space for enhanced ventilation.
This helps in better thermal management, which is especially important for more premium and power-orientated devices, features such as on-device artificial intelligence. As Samsung Technologies put it, the enhancements that come with this LPDDR5X DRAM include a thin capability of 9% less thickness than earlier models and 21. Heat resistance is scaled to be 2% better than other similar skylights.
Samsung’s compact LPDDR5X DRAM packages measure 0.65mm high
Regarding performance, this chip offers up to 8 DLP with a connection bandwidth of up to 4Mbps. 5 Gbps, which is 1/5th the density of typical 25G ZR+ systems, they can fully support 25G ZR+ systems. To this, the company says it is 25 times faster than the previous generation. It is also capable of providing 25% more power efficiency which makes it ideal in areas other than mobile: PCs, servers, and automotive.
Since the LPDDR DRAM package is manufactured in flower print circuit board (PCB) and epoxy molding compound (EMC) methods, the new product is as thin as a fingernail of 0.65mm, which is the slimmest among the existing LPDDR DRAM of 12GB or above. The optimized back-lapping process employed by Samsung is also used to reduce the package height.
To gradually expand the market of low-power DRAM, Samsung has laid down the strategy of providing more 0.65mm LPDDR5X DRAM directly to mobile processor makers and makers of mobile devices. As the market for smartphone and tablet memory, with high performance & high density, lighter and in even smaller packages, grows the company aims to introduce the 6-layer 24GB & the 8-layer 32GB packages into even thinner LPDDR DRAM units for the next generation gadgets.
By building on the strength of a strong background in the chip packaging Samsung can provide slim LPDDR5X DRAM packages that are able to free up space within mobile devices and help with the airflow.